Wash solder paste
Features:

Company research and development of water solid tin paste is also called water-based tin paste, Mini printing water-based tin paste, Mini backlight tin paste, Mini direct washing tin paste, the advantage of better after cleaning, can improve the luminescence by ten percent, the introduction is simple, meet the advantage of outstanding, so as not to be thank you, details can contact me. Mini backlight option 6 print solder paste 5-15 micron. Mini direct display requirements are high, most choose 7 powder, 3-12 micron, excellent S printing molding, no tin, steel net 40 hours do not dry, viscosity does not change, after printing more than 10 hours do not dry chip solid crystal does not fly chip, welding molding cavity less than 8%, welding spot bright without burrs, Mainly used LED chip packaging and wafer (no. 5 powder 15-25um, No. 6 powder 10-20um, No. 7 powder 8-12um, No. 8 powder 2-8um, No. 9 powder is 1-5um. Shenzhen Huamaoxiang has developed a high thixotropy and low viscosity LED solid paste through long time research and development and testing. The solder paste not only has high thermal conductivity, small resistance and fast heat transfer, which can meet the heat dissipation requirements of LED chip, but also has stable solid quality and high welding mechanical strength, which can effectively ensure the reliability of solid crystal. Suitable for processes with spraying, printing, solid crystal and 3D printing needs contact us