Module glue Features:

527 WenXi paste series is designed for today's smart wear new fields, fast welding production process of a kind of no clean type of solder paste, use silver series of low melting point lead-free tin bismuth alloy solder powder and mixture of solder paste, applicable to SMT welding, laser welding equipment and the HOTBAR, welding time shortest can reach 300 milliseconds. This product has no solvent volatilization in the rapid welding process, and no tin bead residue after welding, which can completely eliminate the process of removing tin bead; At the same time, this product belongs to zero halogen formula, little organic residue, and transparent, high surface impedance, high reliability; Can adapt to dispensing, printing and needle transfer and other processes.